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dc.contributor.authorAperador Chaparro, William Arnulfo
dc.contributor.authorVera López, Enrique
dc.date.accessioned2023-05-26T17:38:32Z
dc.date.available2023-05-26T17:38:32Z
dc.date.issued2007
dc.identifier.issn0122-1701spa
dc.identifier.urihttps://repositorio.escuelaing.edu.co/handle/001/2372
dc.description.abstractEn este trabajo se realizó el análisis del deterioro de los recubrimientos cobre – latón obtenidos vía electrodeposición utilizando las técnicas de corriente directa, corriente pulsante directa y corriente pulsante inversa, Para este trabajo se empleo la técnica de curvas de polarización Tafel para obtener un valor estimado de la velocidad de la corrosión. Para hallar el modelamiento eléctrico de la interfase solución – recubrimiento se utilizó la técnica de espectroscopia de impedancias electroquímica (EIS). Se encontró que la resistencia a la corrosión se incremento utilizando la técnica de corriente pulsante inversa.spa
dc.description.abstractThe damage analysis of the coatings based in copper brass obtained by electrodeposition has been studied in detail by means of several techniques such as inverse-pulsing current, direct-pulsing current and direct current. In this study, polarization curves Tafel were used with the purpose of obtain an estimated value of corrosion rate. In order to find the electric modeling of the interface coating-solution the electrochemical impedance spectroscopy (EIS) was employed. An increase in corrosion resistance was found using the inverse pulsing current technique.eng
dc.format.extent6 páginasspa
dc.format.mimetypeapplication/pdfspa
dc.language.isospaspa
dc.publisherUniversidad Tecnológica de Pereiraspa
dc.rights.urihttps://creativecommons.org/licenses/by-nc-nd/4.0/spa
dc.sourcehttps://revistas.utp.edu.co/index.php/revistaciencia/article/view/4927spa
dc.titleEstudio de la corrosión de los electrorecubrimientos cobre-latón sobre sustratos de Zamak utilizando las técnicas DC, PDC Y PRC.spa
dc.title.alternativeCorrosion study of the copper_brass on zamak coatings electrodeposited using using direct, pulse current and pulse current inverseeng
dc.typeArtículo de revistaspa
dc.type.versioninfo:eu-repo/semantics/publishedVersionspa
oaire.accessrightshttp://purl.org/coar/access_right/c_abf2spa
oaire.versionhttp://purl.org/coar/version/c_970fb48d4fbd8a85spa
dc.contributor.researchgroupGrupo de Investigación Ecitrónicaspa
dc.identifier.doihttps://doi.org/10.22517/23447214.4927
dc.identifier.eissn2344-7214spa
dc.identifier.urlhttps://revistas.utp.edu.co/index.php/revistaciencia/article/view/4927
dc.publisher.placeColombiaspa
dc.relation.citationendpage512spa
dc.relation.citationissue36spa
dc.relation.citationstartpage507spa
dc.relation.citationvolume1spa
dc.relation.indexedN/Aspa
dc.relation.ispartofjournalScientia et Technicaeng
dc.relation.referencesKhorasani S, Motieifar A, RASHIDIAN B, optimal pulse shapes for periodic reverse electroplating, Iranian Journal of Science & Technology, Transaction. p. 35-42, 2002.spa
dc.relation.referencesVALIZADEH S, SVEDBERG E.B, LEISNER P, Electrodeposition of compositionally modulated Au/Co alloy layers, Journal of Applied Electrochemistry. p. 97– 104, 2002.spa
dc.relation.referencesAshassi-Sorkhabi H, Hagrah A, Parvini-Ahmadi N, Manzoori J, Zinc_nickel alloy coatings electrodeposited from a chloride bath using direct and pulse current. Surface and Coatings Technology . p.278-283, 2001.spa
dc.relation.referencesChi-Chang Hu, Chi-Ming Wu, Effects of deposition modes on the microstructure of copper deposits from an acidic sulfate bath. Surface and Coatings Technology . p. 75–83, 2003.spa
dc.relation.referencesStankeviciute A, leinartas K, bikulcius G, virbalyte D. Deposition of Zn-Co by constant and pulsed current. journal of applied electrochemistry. p.89-95, 1998.spa
dc.relation.referencesWong K.P, Chan K.C, Yue T.M, study of hardness and grain size in pulse current electroforming of nickel using diferent shaped waveforms. Journal of applied electrochemistry . p. 25-34, 2001.spa
dc.relation.referencesLowenhweim F. Modern Electroplating, John Wiley & Sons, New York. cap 4, 1963.spa
dc.relation.referencesLandolt D, Marlot A, Microstructure and composition of pulse-plated metals and alloys. Surface and Coatings Technology. p.169 –170. 2003.spa
dc.relation.referencesPaunovic M, Schlesinger M. Fundamentals of Electrochemical Deposition. John Wiley & Sons, New York. p. 103, 1998.spa
dc.relation.referencesTsai W-C, Wan C-C. Wang Y-Y. Mechanism of copper electrodeposition by pulse current and its relation to current Efficiency, Journal of Applied Electrochemistry. p.1371–1378, 2002.spa
dc.rights.accessrightsinfo:eu-repo/semantics/openAccessspa
dc.rights.creativecommonsAtribución-NoComercial-SinDerivadas 4.0 Internacional (CC BY-NC-ND 4.0)spa
dc.subject.armarcMetales - Corrosión por esfuerzospa
dc.subject.armarcMetals - Stress corrosioneng
dc.subject.armarcAnálisis electroquímicospa
dc.subject.armarcElectrochemical analysiseng
dc.subject.armarcGalvanoplastiaspa
dc.subject.armarcElectroplatingeng
dc.subject.proposalCorrosiónspa
dc.subject.proposalModelamiento electroquímicospa
dc.subject.proposalElectrodeposiciónspa
dc.subject.proposalEISspa
dc.subject.proposalTafelspa
dc.subject.proposalCorrosioneng
dc.subject.proposalElectrodepositioneng
dc.subject.proposalElectrochemical modelingeng
dc.subject.proposalEISeng
dc.subject.proposalTafeleng
dc.type.coarhttp://purl.org/coar/resource_type/c_2df8fbb1spa
dc.type.contentTextspa
dc.type.driverinfo:eu-repo/semantics/articlespa
dc.type.redcolhttp://purl.org/redcol/resource_type/ARTspa


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